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LS-DYNA in stamping simulation and application

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LS-DYNA in stamping simulation and application

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LS-DYNA in stamping simulation and application

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LS-DYNA in stamping simulation and application

        The objective of this course is to introduce LSDYNA® in stamping simulation, and become familiar with the related user interface. The main topics covered include: 1) introduction the post processor in LSFORM, a new dedicated user interface for stamping simulation; 2) onestep method and the corresponding new functions; 3) incremental forming and the corresponding functions; and 4) hot forming simulation.

DURATION:  One day

LANGUAGE: Mandarin

•  LSFORM post processor (2 hours, Jin Wu)
•  one step method, new function and applications to woven carbon fiber forming  (1 hour, Houfu Fan)。
•  Incremental forming, applications and functions (1 hour Houfu Fan)
•  hot forming simulation and applications, including the simulation of heating, forming, cooling. Material model selection, and simulation efficiency. In addition, welding simulation will also be introduced)  (Jinglin Zheng, 4 hours)


Youcai Wu,Ph.D.

Graduated from the Department of Civil and Environmental Engineering, UCLA (University of California, Los Angeles) in 2005. Joined Karagozian & Case Inc. in January 2006, focusing on advanced LS-DYNA applications in structural analysis, concrete constitutive modeling and independent development of meshfree methods. Joined LSTC in 2015, focusing on development of advanced FEM and meshfree/particle methods and their applications in the integrated analysis of manufacturing and material failure and fragmentation processes.

Bo Ren,Ph.D.

More than 10 yrs. experience on the development of advanced numerical methods for the failure and crack propagation process in brittle/ductile solid materials.

Wei Hu,Ph.D.

Graduated from the department of civil engineering in UCLA in 2007, and joined LSTC in 2009. He has been working on the research and development of adaptivity and meshless methods.

Xiaofei Pan,Ph.D.

Graduated from School of Aerospace in Tsinghua University in 2006. In LSTC, he is responsible for the development of the particle methods and their application in thermal-structural analysis and fluid simulation.

Course fee: 

1.CNY 2000 for each day including electronic class material and lunch.

2.Not including hotel fee.

3.The traning is hosted by LSTC and Shanghai Fangkun.

4.All participates will receive a course completion certificate issued by Livermore Software Technology Corp, US office and Shanghai Fangkun.


             Elva Yu          Tel:18221209107
                                (021)61261195     4008533856   


About Shanghai Fangkun Software Technology Ltd.

        Shanghai Fangkun Software Technology Ltd. as the domestic master distributor authorized by LSTC, is fully responsible for domestic sales, marketing, technical support and engineering consulting services of LS-DYNA. Relying on strong technical support and product development capability of LSTC, by attracting a group of top LS-DYNA application engineers to join, with integrating and managing a wide range of resources such as LS-DYNA distributors and partners in China, Shanghai Fangkun provides strong technical support services for domestic LS-DYNA users, and facilitates customers to use LS-DYNA software for product design and development more efficiently.


         LS-DYNA is a highly advanced general purpose nonlinear finite element program that is capable of simulating complex real world problems. The distributed and shared memory solver provides very short turnaround time on desktop computers and clusters running under Linux, Windows, and Unix. The major development goal of Livermore Software Technology Corporation (LSTC) is to provide, through LS-DYNA, capabilities to seamlessly solve problems that require "Multi-Physics", "Multi-Processing", "Multiple Stages", "Multi-Scale".

Date & Location
Date:  2019-10-21 08:30 ~ 17:00
Location:   Pullman Shanghai South Hotel No.1 Pubei Road, Xuhui District, Shanghai, China, 200235), Xuhui, Shanghai