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由盖世汽车主办的2026第六届智能汽车芯片生态大会将于2026年9月16日在上海召开。我们诚挚邀请您莅临本次大会，共探汽车芯片产业新局，锚定未来发展航向。
2026年，AI算力爆发正深刻重塑汽车芯片产业底层逻辑。AI数据中心对先进制程、HBM高带宽内存及先进封装的巨量需求，直接挤压车规芯片供应保障，供应链安全面临前所未有的考验。与此同时，算力迈入千TOPS时代，产业权力正从"买芯"向"造芯"加速转移；端到端架构、世界模型、VLA与物理AI的快速落地，推动智驾芯片竞争从"TOPS堆叠"转向"有效算力"与生态适配；舱驾融合单芯片方案量产落地，中央计算时代正式开启；RISC-V车规芯片量产元年到来，Chiplet采用率飙升至38%，EDA工具获ISO26262车规认证——从设计、IP、制造到封测、测试的全产业链协同，已成为决定芯片能否"安全上车"的关键。
基于此，本届大会以"芯聚生态 · 智启未来"为主题，围绕算力重构、架构演进、底层攻坚、生态共赢四大篇章展开，聚焦存储暴涨与供应链安全、车企自研与智驾范式跃迁、舱驾融合与端侧大模型、芯片选型与上车准入、SiC/GaN功率双轨进化、RISC-V开放生态、Chiplet与先进封装、车规EDA与IP、HBM高带宽存储、芯片出海与同源共链等核心议题，汇聚全球OEM、Tier1、智驾与座舱芯片企业、存储厂商、功率半导体企业、晶圆制造、EDA/IP厂商、封装测试与测试装备企业及行业机构，共同探讨AI时代汽车芯片产业的发展趋势与破局之道，打造开放、协同、韧性的汽车芯片生态体系，筑牢智能汽车产业的"芯底座"。
我们深信，您的智慧与洞见将是大会的重要养分，期待与您共赴这场产业盛宴，携手开启汽车芯片产业的新征程！
演讲及参展请联系：冯女士 邮箱：conference@gasgoo.com，电话：021-39586681
Dr. Xianzhao Xia, Chief Expert, China Automotive Technology and Research Center (CATARC); Secretary General, China Automotive Chip Standard Testing and Certification Alliance ( CACC)
Computing Power Restructuring & On-Board Breakthrough – The New Landscape of Automotive Chips in the AI Era
车规级芯片产业协同发展：从多元供给迈向全链条规模应用
Collaborative Development of the Automotive-Grade Chip Industry: From Diversified Supply to Full-Chain Scaled Application
顾晓颖 | 盖世汽车合伙人、常务副总裁
Xiaoying Gu, Partner, Executive Vice President，Gasgoo International
RISC_V技术汽车前瞻应用
Forward-Looking Applications of RISC-V in the Automotive Sector
丁可 | 重庆长安汽车股份有限公司 芯片开发高级副总工程师
Ke Ding, Chongqing Changan Automobile Company Limited , Senior Vice President of Chip Development Engineering
“芯”方案 共“智”行,以普惠AI 助力汽车智能化
A Shared Future: Ubiquitous AI for Smarter Mobility
杨全申 | 爱芯元智半导体股份有限公司/车载业务高级产品总监
George Yang, Axera Semiconductor Co., Ltd. / Senior Director of Automotive Product
博世碳化硅：以卓越性能、品质、可靠性服务本地客户
Bosch SiC: Serving Local Customers with Performance, Quality, and Reliability
王骏跃 | 博世功率半导体产品高级经理、碳化硅数据中心全球业务负责人
Junyue Wang, Senior Manager, Power Semiconductor Products, and Global Business Head for Silicon Carbide Data Center, Bosch
上海贝岭方案套片，优化发动机点火应用
Shanghai Belling Solution Chipset for Optimized Engine Ignition Applications
张飞 | 上海贝岭股份有限公司汽车电子市场经理
Felix Zhang, Automotive Electronics Marketing Manager, Shanghai Belling Co., Ltd.
舱驾融合：一颗芯片如何统管整车“数字大脑”
Cockpit-ADAS Integration:How a Single Chip Manages the Vehicle's "Digital Brain"
额日特 | 黑芝麻智能科技有限公司，黑芝麻智能产品负责人
Eric E, Black Sesame Technologies Co., Ltd. Head of product marketing
RISC-V驱动汽车芯片革新
RISC-V Drives Automotive Chip Innovation
许兴奎 | 长城汽车湖南紫荆半导体有限公司 首席战略官兼总助
Xingkui Xu, Chief Strategy Officer & Assistant to the President (Great Wall Motor)
RISC-V 车规芯片落地路径与应用前景
RISC-V Automotive-Grade Chips: Implementation Path and Application Prospects
雷鹏 | 东风汽车公司研发总院 主任工程师
Peng Lei, Dongfeng Motor Corporation R&D Center — Principal Engineer
热点对话：系统级竞争时代：汽车芯片如何从“性能参数”走向“整车定义”？
(1)从“性能参数”到“整车体验”——主机厂与芯片供应商之间，如何建立更高效的协同定义机制？
(2)舱驾融合与中央计算——单芯片方案已量产，下一阶段的系统级挑战在哪里？
(3)从设计到量产——汽车芯片的制造、测试与认证体系，能否跟上架构迭代的速度？
(4)软件定义汽车时代——基础软件与芯片的“软硬协同”，离规模化落地还有多远？
Panel: The Era of System-Level Competition: How Are Automotive Chips Evolving from "Specs" to "Vehicle-Defined"?
(1)From "Spec Sheets" to "Vehicle Experience" – How Can OEMs and Chip Suppliers Establish a More Efficient Co‑Definition Mechanism?
(2)Cockpit‑ADAS Integration and Centralized Computing – With Single‑Chip Solutions Already in Production, What Are the Next System‑Level Challenges?
(3)From Design to Production – Can the Manufacturing, Testing, and Certification Systems for Automotive Chips Keep Pace with Architecture Iteration?
(4)In the Era of Software‑Defined Vehicles – How Far Are We from Scaled Deployment of Hardware‑Software Co‑Design Between Basic Software and Chips?
午餐&VIP午宴&展区参观 Lunch, VIP Luncheon, and Exhibition Tour
Open Architecture & Ecosystem Win-Win – Building the Chip Foundation for Intelligent Vehicles
智能舱驾 协同进化
引领AI汽车新纪元
Cockpit and Driving Intelligence, Evolving Together
Ushering in a New Era of AI-Powered Vehicles
赵翊捷 | 高通技术公司产品市场总监
Yijie Zhao, Director, Product Marketing, Qualcomm Technologies
RISC-V助力软件定义汽车创新
RISC-V Enables Innovation in Software-Defined Vehicles
刘琳 | 英飞凌科技汽车业务市场高级经理 RISC-V生态大中华区负责人
Linda Liu | Head of RISC‑V Ecosystem, Automotive, Infineon Technologies Greater China
RISC-V 在汽车电子领域的实践与探索
RISC-V: Practice and Exploration in Automotive Electronics
李伟立 | 阿里巴巴达摩院处理器架构师
Weili Li, CPU architectist of DAMO, Alibaba
汽车RISC-V行业现状与标准趋势研究
Research on Current Status and Standardization Trends of the Automotive RISC‑V Industry
闫明凯 | 中汽芯（深圳）科技有限公司 技术总监
Mingkai Yan, CATARC Automotive Chip (Shenzhen) Technology Co.,Ltd.
软硬协同：舱驾一体芯片赋能元境持续进化
Hardware‑Software Synergy: Cockpit‑ADAS Integrated Chips Driving the Continuous Evolution of Intelligent Cockpit Ecosystems
徐志刚 | 北汽研究总院 技术总师
Zhigang Xu, Chief Technical Director, BAIC Research Institute
茶歇&合影&展区参观 Tea Break & Exhibition Tour
AI时代车用基础软件及芯片生态协同的思考
Reflections on Automotive Basic Software and Chip Ecosystem Collaboration in the AI Era
姜珊 | 中国一汽研发总院高端汽车集成与控制全国重点实验室 前瞻技术专业设计师、资深基础软件专家
Shan Jiang, State Key Laboratory of Advanced Vehicle Integration and Control，
China FAW Group Co.,LTD.Foresight Technology Designer, Senior Basic Software Expert
闪存芯片在智能网联车行业的市场机会与挑战
Flash Memory Chips in the ICV Industry: Market Opportunities and Challenges
陈建 | 杭州海康存储科技有限公司 产品总监
Jian Chen, Product Director, Hangzhou HIKSEMI Technology Co., Ltd.
从晶圆到整车：车规级制造如何赋能更安全、更智能的汽车
From Wafer to Wheels: How Automotive-Grade Manufacturing Enables Safer and Smarter Vehicles
郭茹 | 格罗方德，汽车业务负责人
Ru Guo, GlobalFoundries, Auto End Market
汽车芯片应用现状及未来应用方向
Current Status and Future Application Directions of Automotive Chips
叶祺 | 上汽集团大乘用车、架构及系统部高级经理
Qi Ye, Senior Manager, Architecture and Systems Department, Passenger Vehicle Division, SAIC Motor
会议结束 Conference Concludes
车规级芯片产业协同发展：从多元供给迈向全链条规模应用
Collaborative Development of the Automotive-Grade Chip Industry: From Diversified Supply to Full-Chain Scaled Application
RISC_V技术汽车前瞻应用
Forward-Looking Applications of RISC-V in the Automotive Sector
“芯”方案 共“智”行,以普惠AI 助力汽车智能化
A Shared Future: Ubiquitous AI for Smarter Mobility
博世碳化硅：以卓越性能、品质、可靠性服务本地客户
Bosch SiC: Serving Local Customers with Performance, Quality, and Reliability
上海贝岭方案套片，优化发动机点火应用
Shanghai Belling Solution Chipset for Optimized Engine Ignition Applications
舱驾融合：一颗芯片如何统管整车“数字大脑”
Cockpit-ADAS Integration:How a Single Chip Manages the Vehicle's "Digital Brain"
RISC-V驱动汽车芯片革新
RISC-V Drives Automotive Chip Innovation
RISC-V 车规芯片落地路径与应用前景
RISC-V Automotive-Grade Chips: Implementation Path and Application Prospects
热点对话：系统级竞争时代：汽车芯片如何从“性能参数”走向“整车定义”？
(1)从“性能参数”到“整车体验”——主机厂与芯片供应商之间，如何建立更高效的协同定义机制？
(2)舱驾融合与中央计算——单芯片方案已量产，下一阶段的系统级挑战在哪里？
(3)从设计到量产——汽车芯片的制造、测试与认证体系，能否跟上架构迭代的速度？
(4)软件定义汽车时代——基础软件与芯片的“软硬协同”，离规模化落地还有多远？
午餐&VIP午宴&展区参观 Lunch, VIP Luncheon, and Exhibition Tour
智能舱驾 协同进化
引领AI汽车新纪元
Cockpit and Driving Intelligence, Evolving Together
Ushering in a New Era of AI-Powered Vehicles
RISC-V助力软件定义汽车创新
RISC-V Enables Innovation in Software-Defined Vehicles
RISC-V 在汽车电子领域的实践与探索
RISC-V: Practice and Exploration in Automotive Electronics
汽车RISC-V行业现状与标准趋势研究
Research on Current Status and Standardization Trends of the Automotive RISC‑V Industry
软硬协同：舱驾一体芯片赋能元境持续进化
Hardware‑Software Synergy: Cockpit‑ADAS Integrated Chips Driving the Continuous Evolution of Intelligent Cockpit Ecosystems
茶歇&合影&展区参观 Tea Break & Exhibition Tour
AI时代车用基础软件及芯片生态协同的思考
Reflections on Automotive Basic Software and Chip Ecosystem Collaboration in the AI Era
闪存芯片在智能网联车行业的市场机会与挑战
Flash Memory Chips in the ICV Industry: Market Opportunities and Challenges
从晶圆到整车：车规级制造如何赋能更安全、更智能的汽车
From Wafer to Wheels: How Automotive-Grade Manufacturing Enables Safer and Smarter Vehicles
汽车芯片应用现状及未来应用方向
Current Status and Future Application Directions of Automotive Chips
会议结束 Conference Concludes
