端侧大模型与物理 AI：为汽车注入 "原生智能" On‑Device Large Models & Physical AI: Infusing Vehicles with "Native Intelligence"
爱芯元智 Axera Semiconductor
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2026-09-16
10:30-10:50
茶歇&合影&展区参观 Tea Break & Group Photo & Exhibition Tour
2026-09-16
10:50-14:00
架构演进：下一代E/E架构与芯片选型Architecture Evolution: Next‑Gen E/E Architecture and Chip Selection
舱驾融合、端侧大模型、物理AI落地，车企如何选芯片？国产芯片如何"上车"？直击真实量产痛点Integration of cockpit and ADAS, on‑device large models, physical AI deployment – how should OEMs choose chips? How can domestic chips get into vehicles? Tackling real‑world mass‑production pain points.
2026-09-16
10:50-11:10
新趋势、新变局，国产车规级半导体的挑战与应对策略 New Trends, New Shifts: Challenges and Strategies for China's Automotive‑Grade Chips
上海贝岭 Shanghai Belling
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2026-09-16
11:10-11:30
舱驾融合：一颗芯片如何统管整车"数字大脑" Cockpit‑ADAS Integration: How a Single Chip Manages the Vehicle’s "Digital Brain"
黑芝麻智能 Black Sesame
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2026-09-16
11:30-11:50
下一代E/E架构芯片选型：智驾·座舱·电驱·区域控制器的逻辑
Next‑Gen E/E Architecture Chip Selection: Logic for ADAS, Cockpit, E‑Drive & Zone Controllers
博世 Bosch
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2026-09-16
11:50-12:30
热点对话：芯片“上车”的最后一公里：准入机制、选型博弈与量产实战
Panel：The Last Mile for Chips to "Get on Board" – Qualification Mechanisms, Selection Strategies & Mass‑Production Practices
构筑端到端智能底座：北汽“芯片 - EEA - 软件 - 数据”四层协同体系的创新实践 Building an End-to-End Intelligent Foundation: BAIC's Innovative Practice of the Four‑Layer Collaborative System of "Chip – EEA – Software – Data"
徐志刚 | 北汽研究总院 技术总师 Zhigang Xu | Chief Technical Director, BAIC Research Institute
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2026-09-16
15:40-16:10
茶歇&合影&展区参观 Tea Break & Exhibition Tour
2026-09-16
16:10-18:10
生态共赢：EDA/IP/设备与全球化 Ecosystem Win‑Win: EDA / IP / Equipment & Globalization
从EDA设计到车规IP，从国产工具链上车到芯片出海——构建韧性、开放、协同的产业新生态From EDA design to automotive‑grade IP, from domestic toolchains to chip going global – building a resilient, open, and collaborative new industrial ecosystem.
2026-09-16
16:10-16:30
面向车规芯片的EDA设计·仿真·验证·DFT
EDA Design, Simulation, Verification & DFT for Automotive Chips
AI定义汽车时代的"芯"坐标——下一个十年 The "Chip" Coordinates in the AI‑Defined Automotive Era – The Next Decade
吉利汽车 GEELY
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2026-09-16
17:50-17:50
会议结束 Conference Concludes
汽车芯片竞争新格局：争夺智能汽车控制权
New Landscape of Automotive Chip Competition: The Battle for Smart Vehicle Control
2026车规级芯片产业报告
2026 Automotive‑Grade Chip Industry Report
AI"抢芯"冲击波：存储暴涨如何重塑汽车供应链格局
AI "Chip Grab" Shockwave: How Storage Surge Reshapes the Automotive Supply Chain
车企造芯大爆发：从"买芯"到"造芯"的产业权力转移
OEM Chip Surge: Power Shift from "Buying" to "Making" Chips
端侧大模型与物理 AI：为汽车注入 "原生智能" On‑Device Large Models & Physical AI: Infusing Vehicles with "Native Intelligence"
茶歇&合影&展区参观 Tea Break & Group Photo & Exhibition Tour
新趋势、新变局，国产车规级半导体的挑战与应对策略 New Trends, New Shifts: Challenges and Strategies for China's Automotive‑Grade Chips
舱驾融合：一颗芯片如何统管整车"数字大脑" Cockpit‑ADAS Integration: How a Single Chip Manages the Vehicle’s "Digital Brain"
下一代E/E架构芯片选型：智驾·座舱·电驱·区域控制器的逻辑
Next‑Gen E/E Architecture Chip Selection: Logic for ADAS, Cockpit, E‑Drive & Zone Controllers
热点对话：芯片“上车”的最后一公里：准入机制、选型博弈与量产实战
Panel：The Last Mile for Chips to "Get on Board" – Qualification Mechanisms, Selection Strategies & Mass‑Production Practices
午餐&VIP午宴&展区参观 Lunch, VIP Luncheon, and Exhibition Tour
RISC-V车规元年：开放架构如何构建自主生态 The Year of RISC‑V Automotive‑Grade: How Open Architecture Builds a Self‑Controlled Ecosystem
RISC-V车规MCU的规模化应用之路 The Path to Large‑Scale Application of RISC‑V Automotive‑Grade MCUs
RISC-V架构：重构下一代汽车“芯”底座的开放之路 RISC‑V Architecture: The Open Path to Rebuilding the Next‑Generation Automotive Chip
Chiplet·先进封装·功率封装·异构集成
Chiplet, Advanced Packaging, Power Packaging & Heterogeneous Integration
构筑端到端智能底座：北汽“芯片 - EEA - 软件 - 数据”四层协同体系的创新实践 Building an End-to-End Intelligent Foundation: BAIC's Innovative Practice of the Four‑Layer Collaborative System of "Chip – EEA – Software – Data"
茶歇&合影&展区参观 Tea Break & Exhibition Tour
面向车规芯片的EDA设计·仿真·验证·DFT
EDA Design, Simulation, Verification & DFT for Automotive Chips
AI时代车用基础软件及芯片生态协同的思考 Reflections on Automotive Basic Software and Chip Ecosystem Collaboration in the AI Era
智能车联网时代 闪存芯片市场的机遇与挑战 Opportunities and Challenges in the Flash Memory Chip Market in the Era of Smart Connected Vehicles
HBM与高带宽车载存储：从"卡脖子"到自主突破
HBM & High‑Bandwidth Automotive Memory: From "Bottleneck" to Self‑Breakthrough
AI定义汽车时代的"芯"坐标——下一个十年 The "Chip" Coordinates in the AI‑Defined Automotive Era – The Next Decade
