Cockpit-ADAS Integration:How a Single Chip Manages the Vehicle's "Digital Brain"
额日特 | 黑芝麻智能科技有限公司，黑芝麻智能产品负责人
Eric E | Black Sesame Technologies Co., Ltd. Head of product marketing
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2026-09-16
11:30-11:50
话题拟定中
Topic TBD
艾和志 | 高通公司产品市场高级总监
Edward Ai | Senior Director, Product Marketing, Qualcomm Technologies
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2026-09-16
11:50-12:10
话题拟定中
Topic TBD
东风汽车
Dongfeng Motor
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2026-09-16
12:10-12:40
热点对话：芯片“上车”的最后一公里：准入机制、选型博弈与量产实战
Panel：The Last Mile for Chips to "Get on Board" – Qualification Mechanisms, Selection Strategies & Mass‑Production Practices
午餐&VIP午宴&展区参观 Lunch, VIP Luncheon, and Exhibition Tour
2026-09-16
14:00-16:10
开放架构：RISC-V重构汽车“芯”底座 Open Architecture – RISC-V Redefining the Automotive Chip Foundation
2026-09-16
13:40-14:00
下一代E/E架构芯片选型：智驾·座舱·电驱·区域控制器的逻辑
Next‑Gen E/E Architecture Chip Selection: Logic for ADAS, Cockpit, E‑Drive & Zone Controllers
王骏跃 | 博世功率半导体产品高级经理、碳化硅数据中心全球业务负责人
Junyue Wang | Senior Manager, Power Semiconductor Products, and Global Business Head for Silicon Carbide Data Center, Bosch
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2026-09-16
14:00-14:20
RISC-V车规元年：开放架构如何构建自主生态 The Year of RISC‑V Automotive‑Grade: How Open Architecture Builds a Self‑Controlled Ecosystem
曹常锋 | 长城汽车湖南紫荆半导体有限公司董事长
Changfeng Cao | Chairman of Cercis-Semi (Great Wall Motor)
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2026-09-16
14:20-14:40
RISC-V车规MCU的规模化应用之路 The Path to Large‑Scale Application of RISC‑V Automotive‑Grade MCUs
刘琳 | 英飞凌科技汽车业务大中华区RISC-V生态负责人
Lin Liu | Head of RISC‑V Ecosystem, Automotive Business, Infineon Technologies Greater China
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2026-09-16
14:40-15:00
RISC-V 在汽车电子领域的实践与探索
RISC-V: Practice and Exploration in Automotive Electronics
李伟立 | 阿里巴巴达摩院处理器架构师
Weili Li | CPU architectist of DAMO, Alibaba
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2026-09-16
15:00-15:20
重塑车规芯片格局：RISC-V标准演进与产业化破局
Reshaping the Automotive Chip Landscape: RISC‑V Standards Evolution and Industrial Breakthroughs
中汽研
CATARC
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2026-09-16
15:20-15:40
软硬协同：舱驾一体芯片赋能元境持续进化
Hardware‑Software Synergy: Cockpit‑ADAS Integrated Chips Driving the Continuous Evolution of Intelligent Cockpit Ecosystems
徐志刚 | 北汽研究总院 技术总师 Zhigang Xu | Chief Technical Director, BAIC Research Institute
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2026-09-16
15:40-16:00
茶歇&合影&展区参观 Tea Break & Exhibition Tour
2026-09-16
16:10-18:10
生态共赢：EDA/IP/设备与全球化 Ecosystem Win‑Win: EDA / IP / Equipment & Globalization
从EDA设计到车规IP，从国产工具链上车到芯片出海——构建韧性、开放、协同的产业新生态From EDA design to automotive‑grade IP, from domestic toolchains to chip going global – building a resilient, open, and collaborative new industrial ecosystem.
2026-09-16
16:00-16:20
AI时代车用基础软件及芯片生态协同的思考
Reflections on Automotive Basic Software and Chip Ecosystem Collaboration in the AI Era
姜珊 | 中国一汽研发总院高端汽车集成与控制全国重点实验室 前瞻技术专业设计师、资深基础软件专家
Shan Jiang | State Key Laboratory of Advanced Vehicle Integration and Control，
China FAW Group Co.,LTD.Foresight Technology Designer, Senior Basic Software Expert
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2026-09-16
16:20-16:40
闪存芯片在智能网联车行业的市场机会与挑战
Flash Memory Chips in the ICV Industry: Market Opportunities and Challenges
From Wafer to Wheels: How Automotive-Grade Manufacturing Enables Safer and Smarter Vehicles
郭茹 | 格罗方德，汽车业务负责人
Ru Guo | GlobalFoundries, Auto End Market
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2026-09-16
17:00-17:20
汽车芯片应用现状及未来应用方向
Current Status and Future Application Directions of Automotive Chips
叶祺 | 上汽集团大乘用车、架构及系统部高级经理
Qi Ye | Senior Manager, Architecture and Systems Department, Passenger Vehicle Division, SAIC Motor
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2026-09-16
17:20-17:40
AI定义汽车时代的"芯"坐标——下一个十年
The "Chip" Coordinates in the AI‑Defined Automotive Era – The Next Decade
吉利汽车 GEELY
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2026-09-16
17:40-17:40
会议结束 Conference Concludes
主办方欢迎致辞
Welcome Address
2026车规级芯片产业报告
2026 Automotive‑Grade Chip Industry Report
AI"抢芯"冲击波：存储暴涨如何重塑汽车供应链格局
AI "Chip Grab" Shockwave: How Storage Surge Reshapes the Automotive Supply Chain
RISC_V技术汽车前瞻应用
Forward-Looking Applications of RISC-V in the Automotive Sector
端侧大模型与物理 AI：为汽车注入 "原生智能" On‑Device Large Models & Physical AI: Infusing Vehicles with "Native Intelligence"
茶歇&合影&展区参观 Tea Break & Group Photo & Exhibition Tour
经典工艺、创新破局：上海贝岭车规级特高压平面MOS赋能汽车BMS、主驱辅电
Classic Process, Innovative Breakthrough: Belling Automotive‑Grade Ultra‑High‑Voltage Planar MOS Empowers Automotive BMS and Main‑Drive Auxiliary Power Supplies
舱驾融合：一颗芯片如何统管整车“数字大脑”
Cockpit-ADAS Integration:How a Single Chip Manages the Vehicle's "Digital Brain"
话题拟定中
Topic TBD
话题拟定中
Topic TBD
热点对话：芯片“上车”的最后一公里：准入机制、选型博弈与量产实战
Panel：The Last Mile for Chips to "Get on Board" – Qualification Mechanisms, Selection Strategies & Mass‑Production Practices
午餐&VIP午宴&展区参观 Lunch, VIP Luncheon, and Exhibition Tour
下一代E/E架构芯片选型：智驾·座舱·电驱·区域控制器的逻辑
Next‑Gen E/E Architecture Chip Selection: Logic for ADAS, Cockpit, E‑Drive & Zone Controllers
RISC-V车规元年：开放架构如何构建自主生态 The Year of RISC‑V Automotive‑Grade: How Open Architecture Builds a Self‑Controlled Ecosystem
RISC-V车规MCU的规模化应用之路 The Path to Large‑Scale Application of RISC‑V Automotive‑Grade MCUs
RISC-V 在汽车电子领域的实践与探索
RISC-V: Practice and Exploration in Automotive Electronics
重塑车规芯片格局：RISC-V标准演进与产业化破局
Reshaping the Automotive Chip Landscape: RISC‑V Standards Evolution and Industrial Breakthroughs
软硬协同：舱驾一体芯片赋能元境持续进化
Hardware‑Software Synergy: Cockpit‑ADAS Integrated Chips Driving the Continuous Evolution of Intelligent Cockpit Ecosystems
茶歇&合影&展区参观 Tea Break & Exhibition Tour
AI时代车用基础软件及芯片生态协同的思考
Reflections on Automotive Basic Software and Chip Ecosystem Collaboration in the AI Era
闪存芯片在智能网联车行业的市场机会与挑战
Flash Memory Chips in the ICV Industry: Market Opportunities and Challenges
从晶圆到整车：车规级制造如何赋能更安全、更智能的汽车
From Wafer to Wheels: How Automotive-Grade Manufacturing Enables Safer and Smarter Vehicles
汽车芯片应用现状及未来应用方向
Current Status and Future Application Directions of Automotive Chips
AI定义汽车时代的"芯"坐标——下一个十年
The "Chip" Coordinates in the AI‑Defined Automotive Era – The Next Decade
