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The Open Compute Project Foundation (OCP) will reach its 10-year anniversary milestone on October 3, 2021, seeing fast growth with increasing members and participation around the world and particularly in China.
We are delighted to host the 3rd OCP China Day, on July 27, 2021, at the Beijing Kerry Hotel. This year’s theme is “Open compute for a new decade: Decarbonization, Efficiency, Adoption”.
Key OCP community members such as Intel, Tencent, Baidu, Alibaba, Seagate, Western Digital, Enflame, Edgecore, and Inspur, as well as experts from Financial, Telco and Energy industries, will come together to discuss AI, edge computing, date center infrastructure, and adoption of open computing technologies.
Together we want to accelerate adoption of open technologies to help build more efficient, innovative, and greener datacenters around the world.
Open compute innovaton tech exhibition
Open compute innovaton tech exhibition
Analysis of OpenRack Architecture
Alibaba cloud heterogeneous computing platform and applications in ODSA architecture
The practice of open computing: financial industry
Inspur: Edge server research and practice
Sign-up, Exhibition Visit
Bill Carter
CTO, Interim Executive Director, OCP Foundation
Archna Haylock
Community Director,OCP Foundation
Steve Helvie
VP of Channels,OCP Foundation
Jun Liu
Vice President, GM of Inspur Information AI&HPC Product Line, Inspur
Li Eric
Director, Intel PRC hyperscale Strategy & Execution, Data Platforms Group
Bill Liu
Vice President of Sales, Western Digital
Nan Wang
Senior Technical Expert, Alibaba Cloud
Gavin jiang
Shanghai Enflame Technology Co., Ltd/Director of System Design
Tom Liu
Senior Manager Product Line Management, Seagate Technology
Jacky Gong
Senior Manager of Foundational Technology Laboratory of ICBC data center
Feng Wang
Director of AI R&D Center, China Telecom Research Institute
Coming soon
Mainstream standard rack server OCP specifications
Bean Zhang
Inspur Server Product Line Senior Manager
New generation of cloud server architecture solutions
Tan Xianguang
Baidu Senior System Engineer
ARM Neoverse Roadmap and Architecture
Derek Qian
Arm China Technical Marketing Director
Tencent IDC Open Computing Practice
YU Qi
Tencent Technology(Shenzhen) Co.Ltd, Senior Solution Architect
The 1st and only OCP READY™ Data Centre in China, revealing their core design and operating principles
Grandy Ai
Chayora VP Data Center Operation
Introduction of JD Cloud Rack Scale Server
Yu Ding, Deputy Director, JD Cloud
Panel Discussion
Coming soon
OAI overview and Inspur practice
Gavin Wang
Director System Architect, Inspur
XMAN assists the new stage of AI-Native development
Wu Zhenghui
Server AI Architect, Baidu
The research and practice of telecom AI empowerment platform
Jizhuang Zhao
Team Leader of AI Platform in AI R&D Center, China Telecom Research Institute
High speed Interconnection status and trend
Michael Yang
Senior FAE Manager, Amphenol ICC (Shanghai) Ltd
Integration of open network and programmability
Jimmy Ou
Director of Open Source Dept, Edgecore Networks
Edge compute status and trend
Park Sun
GM, Edge Computing Business Unit, Inspur
Innovation and Practice of Tencent's independent research and development of AIoT edge gateways
Yuan Huayong
Tencent AIoT Technical Expert
Building the Open Source Ecosystem for innovation in Cloud and Edge
Fei Fei
Principal Engineer, Ampere Computing
Coming soon
Design and practice of Tencent Smart NIC
Ray Liu
Deputy Director, Tencent cloud star lake lab
Open network hardware innovation and practice
Snow Xue
Vice General Manager, Ethernet switch Unit, Inspur
Move Data Faster - Intel Ethernet Technology update
Li Zhiping
Intel Ethernet Technical Sales Specialist
DPU Enables Data Center As The Next Generation Computing Unit
Song Qingchun
NVIDIA Sr. Director Of Market Development, APAC I NVIDIA
Discussion on 48V DC power supply system of Data Center
Brian Yang
Senior FAE, Vicor Corporation
Optimizing Efficiency of Hyperscale Power Solutions
Buwei Zhang
Field Application Manager, Advanced Energy
Open Innovation through OCP Collaboration
Jungsoo KIM
Samsung electronic memory solution product & development team staff engineer
Progress of OCP Vibration and the introduction of Inspur ZNS SSD
Coming soon
Accelerate the transition from air cooling to immersion liquid cooling
A Novel Modular Server Architecture and Design Optimal for Cloud and Edge Applications Scaling
Zhang Jun
Intel Senior Platform Architect
Tencent cloud data center technical practice
Lu Zhigang
Deputy Director, Virtualization Product Center, Tencent Cloud
Cloud Firmware Transition
Song Edmund
Inter Sr.Architect
Baidu AI Cloud Edge Compute Practice, Evolution to Distribted Compute
Alex Wu
Sr. Product Design Manager
Hardening and accelerating your work : from cloud to edge
Li Richard
Director, Platform Security, Intel
Free visit
Open compute innovaton tech exhibition
Open compute innovaton tech exhibition
Analysis of OpenRack Architecture
Alibaba cloud heterogeneous computing platform and applications in ODSA architecture
The practice of open computing: financial industry
Inspur: Edge server research and practice
Sign-up, Exhibition Visit
Mainstream standard rack server OCP specifications
New generation of cloud server architecture solutions
ARM Neoverse Roadmap and Architecture
Tencent IDC Open Computing Practice
The 1st and only OCP READY™ Data Centre in China, revealing their core design and operating principles
Introduction of JD Cloud Rack Scale Server
Panel Discussion
OAI overview and Inspur practice
XMAN assists the new stage of AI-Native development
The research and practice of telecom AI empowerment platform
High speed Interconnection status and trend
Integration of open network and programmability
Edge compute status and trend
Innovation and Practice of Tencent's independent research and development of AIoT edge gateways
Building the Open Source Ecosystem for innovation in Cloud and Edge
Design and practice of Tencent Smart NIC
Open network hardware innovation and practice
Move Data Faster - Intel Ethernet Technology update
DPU Enables Data Center As The Next Generation Computing Unit
Discussion on 48V DC power supply system of Data Center
Optimizing Efficiency of Hyperscale Power Solutions
Open Innovation through OCP Collaboration
Progress of OCP Vibration and the introduction of Inspur ZNS SSD
Accelerate the transition from air cooling to immersion liquid cooling
A Novel Modular Server Architecture and Design Optimal for Cloud and Edge Applications Scaling
Tencent cloud data center technical practice
Cloud Firmware Transition
Baidu AI Cloud Edge Compute Practice, Evolution to Distribted Compute
Hardening and accelerating your work : from cloud to edge
Free visit
